MSI announces its new AMD X670 Motherboard product lineup with support for the upcoming AMD Ryzen 7000 Series processors.
The AMD Ryzen 7000 Series processors are the first to use the 5nm FinFET process from TSMC as well as introducing a brand-new platform and socket from AMD, bringing new features like PCIe 5.0, DDR5 memory support, and more.
The X670 chipset is divided into two segments — X670 Extreme and X670. X670E supports PCIe 5.0 through both the PCIe slot and M.2 slot whereas X670 motherboards support PCIe 5.0 through the M.2 slot exclusively. In addition to PCIe 5.0 and DDR5 support, all MSI X670E and X670 motherboards specifications have been upgraded to include rear USB Type-C with now support up to Display Port 2.0 output. Even more, MEG motherboards’ front USB 3.2 Gen2 x2 Type-C will support 60W Power Delivery. The VRM design has also been upgraded with up to 24+2 Power Phases with 105A Smart Power Stage.
The X670E Gaming motherboards come with feature designs that further support enhancing your motherboard. It has the exclusive M-Vision Dashboard that allows customization with a touch of a finger to see more detailed visual aspects of your motherboard status.
A few new features that come along with the X670E Motherboards are screw-less M.2 Shield Frozr as well as MSI’s patent-pending M.2 Shield Frozr with magnetic design to help with the easy upgrading or installing of M.2 SSDs. As well as a smart button in the rear I/O panel for more customization from entering safe boot, turning on/off all RGB LEDs, or activating the Turbo Fan.
All MSI X670 motherboards support ARGB Gen2 devices, giving RGB enthusiasts more options for customizing their PCs.
MSI’s MEG Series — the MEG X670E GODLIKE and MEG X670E ACE motherboards — have even more features. The MEG Series adopt E-ATX PCB size and have up to 24+2 VRM phases with 105A Smart Power Stage. They are cooled by a Stacked fin array design heatsink and a heat pipe to dissipate heat effectively to maintain peak performance. It also has a MOSFET baseplate for more heat dissipation for the VRM while the Metal backplate is there to help protect the PCB and keep the rigidity of the board.
The MEG Series motherboards are equipped with up to 4 onboard M.2 slots including 1 M.2 PCIe 5.0 x4 slot and a M.2 XPANDER-Z GEN5 DUAL add-on card inside the box for 2 additional PCIe 5.0 x4 M.2 slots.
The MPG Series meanwhile, offer more upgrades for the new AMD platform. The MPG X670E CARBON WIFI motherboard features 2 PCIe 5.0 x16 slots and 4 M.2 slots that are split into 2 M.2 PCIe 5.0 x4 and 2 PCIe 5.0 x4. It comes with 18+2 VRM power phases with 90A and is cooled by an extended heatsink design. Just like the last generation, there will be a collaboration with EK Water Blocks for a customed monoblock that covers the processor, VRM and M.2 section.
And lastly, we have the PRO Series, best for enterprises and creators. The PRO X670-P WIFI is equipped with a 14+2 Phases Duet Rail Power System and dual 8-pin CPU power connectors. It also comes equipped with 1 M.2 PCIe 5.0 x4 slot, 2.5G LAN, and Wi-Fi 6E solution, with a linear design that matches any office or studio layout for a more unified look.
MSI will launch X670E and X670 motherboards soon in sometime Q3 2022. Stay tuned for more information on msi.com.