MediaTek launches the Dimensity 1050 system-on-chip (SoC), its first mmWave 5G chipset to power the next generation of 5G smartphones.
The Dimensity 1050 is built on the ultra-efficient TSMC 6nm production process with an octa-core CPU. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5GHz and the latest Arm Mali-G610 GPU.
The chip uses dual connectivity, combining mmWave 5G and sub-6GHz to switch between network bands. MediaTek said it is capable of delivering up to 53 percent faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone.
In addition to the 5G tech, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek’s HyperEngine 5.0 gaming technology for lower-latency connections with the new tri-band — 2.4GHz, 5GHz, and 6GHz –- that extends game time and performance. Additionally, it also supports UFS 3.1 storage and LPDDR5 memory ensuring faster data streams to accelerate apps, social feeds, and faster FPS in games.
Additional features of the Dimensity 1050 include:
- Support for True Dual 5G SIM (5G SA + 5G SA) and Dual VoNR.
- Super-fast 144Hz Full HD+ displays with intense, vibrant colors through MediaTek’s MiraVision 760.
- Dual HDR video capture engine, enabling users to simultaneously stream with the front and rear cameras.
- Excellent noise reduction for superb low-light photos and MediaTek’s APU 550 improves AI camera actions.
- Wi-Fi 6E support for superior power efficiency and 2×2 MIMO antenna brings faster, more reliable connections.
MediaTek also announced two additional chipsets to expand its 5G and gaming chipset families — the Dimensity 930 and Helio G99.
The Dimensity 930 enables 5G smartphones to download data faster and stay connected regardless of location with 2CC-CA, including mixed duplex FDD+TDD for higher speeds and greater reach. It is equipped with MiraVision HDR video playback and display for 120Hz Full HD+ displays and HDR10+ video. Additionally, it also supports HyperEngine 3.0 Lite to enhance gaming to ensure lower latency and more battery life.
The Helio G99, on the other hand, is a 4G/LTE chip with higher throughput rates and better power efficiency compared to the Helio G96. This SoC will be available in the second quarter of 2022.
Smartphones powered by the Dimensity 1050 and the Helio G99 will be on the market in the third quarter of 2022. Meanwhile, the Dimensity 930 will be available on the market in the second quarter of 2022.