MediaTek announced that it has successfully developed its first chip using the 3nm process technology from TSMC, the world’s largest contract chip manufacturer. The flagship Dimensity is a system-on-chip (SoC) that integrates various components such as CPU, GPU, modem, and AI engine on a single chip.
MediaTek claims that the Dimensity SoC will offer superior performance and power efficiency for flagship smartphones and other devices, such as tablets and intelligent cars.
The Dimensity SoC is expected to enter mass production in 2024, making it one of the first products to use TSMC’s 3nm technology. TSMC’s 3nm process is the most advanced semiconductor technology in the industry, offering significant improvements in speed, power, and density compared to its previous 5nm process. According to TSMC, its 3nm process can deliver up to 18% faster speed or 32% lower power consumption at the same performance level, as well as up to 60% higher logic density.
The announcement marks a major milestone in the long-standing strategic partnership between MediaTek and TSMC, which have collaborated on various chip projects over the years. Both companies have expressed their commitment to using the world’s most advanced technology to create cutting-edge products that enhance the user experience in the flagship market.
“We are committed to our vision of using the world’s most advanced technology to create cutting-edge products that improve our lives in meaningful ways,” said Joe Chen, President of MediaTek. “TSMC’s consistent and high-quality manufacturing capabilities enable MediaTek to fully demonstrate its superior design in flagship chipsets, offering the highest performance and quality solutions to our global customers and enhancing the user experience in the flagship market.”
“This collaboration between MediaTek and TSMC on MediaTek’s Dimensity SoC means the power of industry’s most advanced semiconductor process technology can be as accessible as the smartphone in your pocket,” said Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC. “Throughout the years, we have worked closely with MediaTek to bring numerous significant innovations to the market and are honored to continue our partnership into the 3nm generation and beyond.”
MediaTek’s Dimensity SoCs are designed to meet the ever-increasing user experience requirements for mobile computing, high-speed connectivity, artificial intelligence, and multimedia.
The Dimensity SoCs support various features such as dual 5G SIM, Wi-Fi 6E, Bluetooth 5.2, ultra-low latency gaming mode, advanced camera capabilities, and more. MediaTek’s first flagship chipset using TSMC’s 3nm process is expected to empower smartphones, tablets, intelligent cars, and various other devices starting in the second half of 2024.
