MediaTek has announced the Dimensity 7450 and 7450X, successors to last year’s 7400 series. The new chips have the same CPU and GPU setup of four Cortex‑A78 cores at 2.6GHz, four Cortex‑A55 cores at 2.0GHz, and Mali‑G615 MC2 graphics, but bring targeted improvements.
The biggest change is connectivity. Both chips now come with a 5G Release 17 modem. That means better efficiency, support for three‑carrier aggregation, faster speeds while on the move, and quicker recovery when your phone leaves dead zones.
AI performance also sees a 7% boost, particularly in photography. The chips have improved image processing, which is where midrange phones often compete.
The Dimensity 7450X adds support for dual‑display setups. This feature makes it a fit for budget foldables, giving brands a way to offer flexible designs without using high‑end silicon.
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MediaTek says devices powered by the new SoCs will arrive in the coming months. The upgrades may be modest, but they keep MediaTek’s midrange lineup competitive in areas like connectivity, efficiency, and camera features.
