MediaTek unveils the Dimensity 8100 and 8000, made for premium 5G smartphones. The 5nm chips were built from the same hardware as the Dimensity 9000.
According to CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, the Dimensity 8000 series is the “little brother” of the flagship Dimensity 9000 chipset, offering the same features with better energy efficiency. The chips will likely be used on top-end mid-range phones.
The Dimensity 8100 and 8000 come with four big Arm Cortex-A78 cores and four small A55 cores, with speeds of up to 2.85GHz and 2.75GHz, respectively. Both are paired with an Arm Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technology.
The new chips will also feature MediaTek’s fifth-generation API, the APU 580, and support up to 200MP cameras and 4K60 HDR10+ videography, Wi-Fi 6E and Bluetooth 5.3, up to 168Hz refresh rate at FHD+ displays for the Dimensity 8000, and up to 120Hz at WQHD+ for the 8100.
MediaTek also announced the 6nm Dimensity 1300 chip for mid-range 5G phones. It integrates an octa-core CPU with an Arm Cortex-A78 clocked up to 3GHz, three Arm Cortex-A78 super cores, and four Arm Cortex-A55 efficiency cores, along with an Arm Mali-G77 GPU and MediaTek APU 3.0. The chipset also supports up to 200MP, and integrates MediaTek’s HyperEngine 5.0.
According to MediaTek, we should expect to see smartphones powered by the Dimensity 8100, Dimensity 8000, and Dimensity 1300 sometime in the first quarter of 2022 by some of the “world’s biggest smartphone brands.”