MediaTek announces its new Dimensity 6000 series of chipsets for mainstream 5G devices. The series includes the Dimensity 6100+, which offers advanced features such as high-performance cores, AI-powered cameras, 10-bit displays, and low power consumption.
The Dimensity 6100+ is designed to make 5G connectivity more accessible and affordable for consumers in developing and developed markets. It supports the latest 5G standards and features MediaTek’s UltraSave 3.0+ technology, which reduces power consumption by 20% compared to other solutions.
The chipset also delivers a premium user experience with its powerful CPU and GPU, which can handle up to 108MP cameras, 2K at 30fps video recording, and 120Hz displays. It also supports AI-bokeh and AI-color technologies, which enhance portraits and selfies with artistic effects.
“The MediaTek Dimensity 6000 series makes it possible for device makers to stay ahead of the curve with impressive upgrades that boost performance, increase power efficiency and reduce material costs,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
The Dimensity 6100+ is part of MediaTek’s broad 5G portfolio, which covers different price tiers and segments. The company also offers the Dimensity 9000 series for flagship devices, the Dimensity 8000 series for premium devices, and the Dimensity 7000 series for high-tech devices.
The first smartphones featuring the Dimensity 6100+ chipset will be available in the third quarter of 2023.
For more information about MediaTek’s mobile platform, visit https://i.mediatek.com/mediatek-5g.
